OFH-4100 Series
特 點 Features 
■ 業界最快速對準時間的吸附保持式Aligner。
■ 可透過指令對齊多種尺寸晶圓。
■ 可控制平邊部分與缺口部分的停止位置。
■This vaccum type Aligner achieves the industry fastest alignment time.
■Wafer alignment of some size is possible by a command.■ 業界最快速對準時間的吸附保持式Aligner。
■ 可透過指令對齊多種尺寸晶圓。
■ 可控制平邊部分與缺口部分的停止位置。
■This vaccum type Aligner achieves the industry fastest alignment time.
■This aligner can control the stop position of flat orientation part and the notch part.
規 格 Specifications
| 型號 Model |
適用晶圓尺寸 Applicable Wafer Size（＊1）（＊2） |
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| OFH-4100 | 200-300mm | ||||
| OFH-4101 | 150-200mm | ||||
| OFH-4102 | 100-200mm | ||||
| OFH-4103 | 50-150mm | ||||
| 位置重複精度Repeatability | XY direction: ±0.1mm each θ direction: ±0.2° |
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| 對位時間 Alignment Time | 1.8sec. （＊3） | ||||
| 潔淨度 Cleanliness | ISO Class 3 （ISO-14644） | ||||
| ROBOT本體質量 Mass | 8kg | ||||
| 必要諸元 Facilities |
真空 Vacuum | -80kPaG or less, 10NL/min. | |||
| 電源 Power | 24±10%VDC, 3A | ||||
| 設置環境 Environment |
溫度 Temperature | 15-25℃ | |||
| 濕度 Humidity | 20-60%, No condensation | ||||
＊2. 有晶圓邊緣缺角與毛邊檢測的系列可供選擇，如有需求歡迎與本公司聯繫。
＊3. 50mm晶圓的對位時間為2.5sec.。
＊1. There are OFH-4100Q series as quartz wafer compatible products. Please inquire details.
＊2. There are wafer edge inspection series with an option. Please inquire details.
＊3. For 50 mm wafers, the alignment time is 2.5 seconds
