DAIHEN
UTM-R3700F
特 長 Features
■ 水平2.7m、垂直1.6m的大動作範圍,不需走行軸即可對應各種Lay Out圖面。
■ 一台ROBOT可連接4個FOUP,最多可連接8個FOUP。
■ This unit accommodates various device layouts thanks to its range of 2.7 m horizontally and 1.6 m vertically without requiring Y-axis track.
■ A single robot can access from 4 FOUPs to a maximum of 8 FOUPs.
■縮短Take Time並提高設備的生產量
■ Reduces takt time and improves equipment throughput
仕 様 Specifications*1*2
■ 水平2.7m、垂直1.6m的大動作範圍,不需走行軸即可對應各種Lay Out圖面。
■ 一台ROBOT可連接4個FOUP,最多可連接8個FOUP。
■ This unit accommodates various device layouts thanks to its range of 2.7 m horizontally and 1.6 m vertically without requiring Y-axis track.
■ A single robot can access from 4 FOUPs to a maximum of 8 FOUPs.
■縮短Take Time並提高設備的生產量
■ Reduces takt time and improves equipment throughput
仕 様 Specifications*1*2
型號 Model |
UTM-R3700F |
||
ROBOT種類 Robot Type | 6-axis articulated system | ||
動作範圍 Operation Range |
X1, X2-axis(前後)(Extension) | 590mm | |
θ-axis(旋回)(Rotation) | 332° | ||
Z-axis(昇降)(Elevation) | 310-703.8mm | ||
Y-axis(左右)(Slide) | ±767.5mm | ||
A-axis(左右傾斜補正)(Correction of Y-axis tilt) | ±2° | ||
最大動作速度 Max. Operation Speed |
X1, X2-axis | 1600mm/sec. | |
θ-axis | 540°/sec. | ||
Z-axis | 1500mm/sec. | ||
Y-axis | 1500mm/sec. | ||
動作時間 Cycle Time |
X1, X2-axis | 0.9sec./590mm | |
θ-axis | 1.0sec./332° | ||
Z-axis | 0.8sec./703.8mm | ||
Y-axis | 1.4sec./1535mm | ||
位置重複精度 Repeatability | XθY directions(composite): ±0.1mm, Z direction: ±0.1mm | ||
可搬重量 Payload | 0.5kg/arm(including Hand, Wafer) | ||
潔淨度Cleanliness | 夾持規格Edge Clamp E/E type | ISO Class 3(ISO-14644) | |
吸附規格Vacuum E/E type | ISO Class 1(ISO-14644) | ||
ROBOT本體質量Mass | 74kg | ||
必要諸元 Facilities |
夾持規格Edge Clamp E/E type | 正壓Air | 0.3-0.7MpaG |
吸附規格Vacuum E/E type | 真空Vacuum | -80kPaG or less, 10NL/min. | |
真空(機内排気用) Vacuum(for purging) | -80kPaG or less, 40NL/min total | ||
設置環境 Environment |
温度 Temperature | 0-40℃ | |
濕度 Humidity | 20-70%, No condensation | ||
對應控制器Controller | CFD ▶ P.17 |
*1. Transfer performance differs from the standard when options are added. *2. Wafer sensor and Mapping sensor are available