半導體搬送ROBOT
EG-303 Series
Aligner
特 長 Features
■ 以3個可動夾爪edge grip方式進行高精度定心
■ 搭配選配的緩衝埠可最大限度縮短ROBOT對位等
待時間
■ Centering high-precision by the edge grip method with
three operating fingertip
■ Robot waiting time until alignment is finished is minimized by
the buer port of the option
*照片為EG-303B(帶緩衝)。
*The picture is the specification of EG-303B (With
buffer).
規 格 Specifications
型號 Model |
EG-303 |
||
適適用晶圓尺寸 Applicable Wafer Size |
300mm | ||
晶圓夾持方法 Wafer Holding Method | Edge clamp | ||
位置重複精度 Repeatability |
高精細模式 High Accuracy Mode |
XY: ±0.05mm θ: ±0.075° |
|
一般模式 Normal Mode |
XY: ±0.2mm θ: ±0.1 |
||
對位時間 Alignment Time |
高精細模式 High Accuracy Mode |
Average 7.5sec. | |
一般模式 Normal Mode |
Average 3.5sec. | ||
潔淨度 Cleanliness | ISO Class 3(ISO-14644) | ||
ROBOT本體質量 Mass | 7kg | ||
必要諸元 Facilities |
電源 Power | 24±10%VDC, 3A | |
設置環境 Environment |
溫度 Temperature | 0-40℃ | |
濕度 Humidity | 20-70%, No condensation |