半導體搬送ROBOT
OFH-4100 Series
特 點 Features 
■ 業界最快速對準時間的吸附保持式Aligner。
■ 可透過指令對齊多種尺寸晶圓。
■ 可控制平邊部分與缺口部分的停止位置。
■This vaccum type Aligner achieves the industry fastest alignment time.
■Wafer alignment of some size is possible by a command.■ 業界最快速對準時間的吸附保持式Aligner。
■ 可透過指令對齊多種尺寸晶圓。
■ 可控制平邊部分與缺口部分的停止位置。
■This vaccum type Aligner achieves the industry fastest alignment time.
■This aligner can control the stop position of flat orientation part and the notch part.
規 格 Specifications
型號 Model |
適用晶圓尺寸 Applicable Wafer Size(*1)(*2) |
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OFH-4100 | 200-300mm | ||||
OFH-4101 | 150-200mm | ||||
OFH-4102 | 100-200mm | ||||
OFH-4103 | 50-150mm | ||||
位置重複精度Repeatability | XY direction: ±0.1mm each θ direction: ±0.2° |
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對位時間 Alignment Time | 1.8sec. (*3) | ||||
潔淨度 Cleanliness | ISO Class 3 (ISO-14644) | ||||
ROBOT本體質量 Mass | 8kg | ||||
必要諸元 Facilities |
真空 Vacuum | -80kPaG or less, 10NL/min. | |||
電源 Power | 24±10%VDC, 3A | ||||
設置環境 Environment |
溫度 Temperature | 15-25℃ | |||
濕度 Humidity | 20-60%, No condensation |
*2. 有晶圓邊緣缺角與毛邊檢測的系列可供選擇,如有需求歡迎與本公司聯繫。
*3. 50mm晶圓的對位時間為2.5sec.。
*1. There are OFH-4100Q series as quartz wafer compatible products. Please inquire details.
*2. There are wafer edge inspection series with an option. Please inquire details.
*3. For 50 mm wafers, the alignment time is 2.5 seconds